PRODUCT DESCRIPTION

LOCTITE ABLESTIK 3880 provides the following product

characteristics:

Technology Epoxy

Chemical Type Epoxy

Appearance (uncured) Silver pasteLMS

Appearance (cured) Silver solidLMS

Components One component -

requires no mixing

Cure Heat cure

Application Conductive adhesive

Key Substrates Electronic components

Other Application Areas Thermal conduction

Dispense Method Syringe and Stencil print

LOCTITE ABLESTIK 3880 is designed for bonding of metals,

ceramics, rubbers and plastics as used in electronic parts, where good

adhesion combined with electrical and thermal conductivity is required.

Typical applications include bonding surface mount devices to flexible

or rigid substrates, bonding of semiconductor elements, joining EMI

parts, bonding electrodes, lead wires or other connectors that require

conductivity.

TYPICAL PROPERTIES OF UNCURED MATERIAL

Specific Gravity @ 25 °C 2.4

Viscosity, Brookfield - RVT, 25 °C, mPa·s (cP):

Spindle 14, speed 5 rpm

, with small sample adaptor

50,000 to 150,000LMS

VOC, ASTM D 3960, g/l 74

Moisture Content, ASTM D 4017, % <0.01

Total Volatile Content, ASTM D 2369, % 3.0

Flash Point - See SDS

产品描述

乐泰 ABLESTIK 3880 具有以下产品特性：

技术：环氧树脂

化学类型：环氧树脂

外观（未固化）：银色膏状物

外观（固化）：银色固体

组分：单组分 -

无需混合

固化方式：热固化

应用：导电胶

主要基材：电子元件

其他应用领域：导热

点胶方式：注射器和丝网印刷

乐泰 ABLESTIK 3880 专为粘合电子元件中使用的金属、

陶瓷、橡胶和塑料而设计，适用于需要良好

粘合力以及导电性和导热性的场合。

典型应用包括将表面贴装器件粘合到柔性

或刚性基材上、粘合半导体元件、连接电磁干扰 (EMI)

部件、粘合电极、引线或其他需要导电性的连接器。

未固化材料的典型性能

比重（25℃）：2.4

粘度（Brookfield RVT，25℃，mPa·s (cP)）：

转子 14，转速 5 rpm

，使用小型样品适配器

50,000 至 150,000 LMS

VOC（ASTM D 3960），g/L：74

水分含量（ASTM D 4017），%：<0.01

总挥发分含量（ASTM D 2369），%：3.0

闪点 - 参见安全数据表