PRODUCT DESCRIPTION

LOCTITE ABLESTIK 2958 provides the following product

characteristics:

Technology Epoxy

Appearance Silver

Cure Heat cure

Product Benefits • Snap curable

• Thermally conductive

• Electrically conductive

• Long pot life

• Screen printable

Mix Ratio, by weight -

Resin : Hardener

100 : 6

Typical Assembly

Applications

Chip bonding, Electrical modules,

Printed circuitry, Wave guides and

High frequency shields

Operating Temperature -60 to 175 °C

Application Bonding or Sealing

LOCTITE ABLESTIK 2958 is a two-part, smooth paste of

specially refined and processed epoxy and silver components,

recommended for electronic, microelectronic and die-attach

bonding and sealing applications that require superior electrical

and mechanical properties. It is free of contaminating solvents

and additives and develops strong durable seals and coatings.

TYPICAL PROPERTIES OF UNCURED MATERIAL

Mixed Viscosity, cps @ 25 ºC 40,000

Thixotropic Index (5/50 rpm) 2.9

Specific Gravity, mixed 2.65

Reactive solids contents, % 100

Pot life , hours 4

Flash Point - See SDS

产品描述

乐泰 ABLESTIK 2958 具有以下产品特性：

技术：环氧树脂

外观：银色

固化方式：热固化

产品优势：

• 快速固化

• 导热

• 导电

• 适用期长

• 可丝网印刷

混合比例（重量比）：

树脂：固化剂

100 : 6

典型应用

芯片键合、电子模块、

印刷电路、波导和高频屏蔽

工作温度：-60 至 175 °C

应用：键合或密封

乐泰 ABLESTIK 2958 是一种双组分、光滑的膏状物，由

特殊精炼和加工的环氧树脂和银成分组成，推荐用于电子、微电子和芯片粘接

需要优异电气和机械性能的键合和密封应用。它不含污染性溶剂

和添加剂，可形成牢固耐用的密封和涂层。

未固化材料的典型性能

混合粘度（cps @ 25 ºC）：40,000

触变指数（5/50 rpm）：2.9

混合比重：2.65

活性固体含量（%）：100

适用期（小时）：4

闪点：参见安全数据表