PRODUCT DESCRIPTION

LOCTITE ABLESTIK 2907 provides the following product

characteristics:

Technology Epoxy

Appearance Silver

Filler Type Silver

Cure Room Temperature or Heat Cure

Components Two component - requires mixing

Product Benefits

 ● Electrically conductive

● Thermally conductive

● Medium viscosity

● Two component

● Room temperature cure● Solvent-free

● Free of copper or carbon additives

● Bond dissimilar substrates

Typical Assembly

Applications

Electrical modules, Printed circuitry,

Wave guides, Flat cables and High

frequency shields

Application Assembly, Bonding, Sealing or Repair

Surfaces Metals, Ceramics, Glass and Plastic

laminates

LOCTITE ABLESTIK 2907 is designed for electronic bonding

and sealing applications that require a combination of good

mechanical and electrical properties. It can also be used as a

"cold solder" for heat sensitive components where hot

soldering is impratical.

TYPICAL PROPERTIES OF UNCURED MATERIAL

Mixed Viscosity, mPa·s (cP) :

cp #52, 10 rpm 6,500

Thixotropic Index (1/10 rpm) 3.5

Pot life , minutes 100

Flash Point - See SDS

产品描述

乐泰 ABLESTIK 2907 具有以下产品特性：

技术：环氧树脂

外观：银色

填料类型：银

固化方式：室温或加热固化

组分：双组分 - 需要混合

产品优势：

● 导电

● 导热

● 中等粘度

● 双组分

● 室温固化

● 无溶剂

● 不含铜或碳添加剂

● 可粘合不同基材

典型应用

电气模块、印刷电路、波导、扁平电缆和高频屏蔽

应用范围：组装、粘合、密封或维修

适用表面：金属、陶瓷、玻璃和塑料层压板

乐泰 ABLESTIK 2907 专为电子粘合

和密封应用而设计，适用于需要兼具良好机械性能和电气性能的应用。

它也可用作热敏元件的“冷焊”，尤其适用于不宜进行热焊的情况。

未固化材料的典型特性

混合粘度，mPa·s (cP)：

cp #52，10 rpm 6,500

触变指数 (1/10 rpm) 3.5

适用期，分钟 100

闪点 - 参见安全数据表