PRODUCT DESCRIPTION

LOCTITE ABLESTIK ABP 2025DSINP provides the following

product characteristics:

Technology Proprietary hybrid chemistry

Appearance Red

Filler type Silica

Product benefits

Non-conductive

Good adhesion to a variety of

substrates

High hot/wet die shear strength

Formulated without intentionally

added PFAS

Cure Heat cure

Application Die attach

Typical package application Flex and Laminate

LOCTITE® ABLESTIK ABP 2025DSINP, die attach adhesive is

designed for use in array packaging. LOCTITE® ABLESTIK ABP

2025DSINP is the PFAS removed version of LOCTITE® ABLESTIK

2025DSI.

产品描述

乐泰 ABLESTIK ABP 2025DSINP 具有以下产品特性：

技术：专有混合化学配方

外观：红色

填料类型：二氧化硅

产品优势：

不导电

对多种基材具有良好的粘合性高热/湿式芯片剪切强度配方中未故意添加 PFAS

固化方式：热固化

应用：芯片粘接

典型封装应用：柔性封装和层压封装

乐泰 ABLESTIK ABP 2025DSINP 芯片粘接胶专为阵列封装而设计。

乐泰 ABLESTIK ABP

2025DSINP 是乐泰® ABLESTIK

2025DSI 的无 PFAS 版本。

2025DSI