PRODUCT DESCRIPTION

LOCTITE® ABLESTIK ATB 100MD6N provides the following product

characteristics:

Technology Epoxy film

Appearance White

Application Semiconductor film; Non-Conductive Die

Attach film

Filler type Silica

Carrier type Non UV PSA adhesive (PSA1)

Carrier thickness, μm 87

Adhesive thickness, μm 7 to 25

Wafer size, in 8 and 12

Typical package

application

Discrete, IC, Chip stack packages, Die

to substrate and Die to die stack

Product benefits

SVHC free, REACH compliance

Excellent MSL performance

High thermal budget tolerance

Skip cure process

DBG (Dicing Before Grinding) and

SDBG (Stealth Dicing Before

Grinding) technology usable

LOCTITE® ABLESTIK ATB 100MD6N adhesive film is formulated for

use in wafer lamination processes or as a preform decal. It is

designed for use in both mother/daughter die in stack packages.

产品描述

乐泰 ABLESTIK ATB 100MD6N 具有以下产品特性：

技术：环氧树脂膜

外观：白色

应用：半导体膜；非导电芯片

贴合膜

填料类型：二氧化硅

载体类型：非紫外线固化压敏胶 (PSA1)

载体厚度：87 微米

胶层厚度：7 至 25 微米

晶圆尺寸：8 英寸和 12 英寸

典型封装

应用：分立器件、集成电路、芯片堆叠封装、芯片到基板以及芯片到芯片堆叠

产品优势：

不含 SVHC，符合 REACH 法规优异的 MSL 性能高热容差

无需固化工艺可使用 DBG（研磨前切割）和SDBG（研磨前隐形切割）技术

乐泰 ABLESTIK ATB 100MD6N 贴合膜专为晶圆层压工艺或预成型贴片而配制。它

设计用于堆叠封装中的母芯片/子芯片。