PRODUCT DESCRIPTION

LOCTITE® ABLESTIK ATB 125GR2 provides the following product

characteristics:

Technology Epoxy film

Appearance White yellow

Cure Heat cure

Product benefits

Excellent workability

Excellent adhesion on both metal

lead frames and BGAs

High reliability

High modulus

Meets thin wafer requirements

Recommended for small to

medium die size packages

Consistent dicing and die pickup

for small to medium die

applications

Application Semiconductor film; Non-conductive

die attach film

Carrier type 6140 D/T

Carrier thickness, µm 110

Adhesive thickness, µm 25

Wafer size, in 8 and 12

Typical package application IC, Discrete, Chip stack packages

LOCTITE® ABLESTIK ATB 125GR2 adhesive film is formulated for

use in wafer lamination processes or as a preform decal. This

adhesive is suitable for use on small to medium size die sizes.

LOCTITE® ABLESTIK ATB 125GR2 has an integrated dicing tape

designed for consistent die pickup

产品描述

乐泰 ABLESTIK ATB 125GR2 具有以下产品特性：

技术：环氧树脂薄膜

外观：白黄色

固化方式：热固化

产品优势：

优异的可加工性

对金属

引线框架和 BGA 均具有优异的粘合性

高可靠性

高模量

满足薄晶圆要求

推荐用于中小型芯片封装

适用于中小型芯片应用，切割和芯片拾取性能稳定

应用：半导体薄膜；非导电

芯片粘接膜

载体类型：6140 D/T

载体厚度：110 µm

粘合剂厚度：25 µm

晶圆尺寸：8 英寸和 12 英寸

典型封装应用：IC、分立器件、芯片堆叠封装

乐泰 ABLESTIK ATB 125GR2 粘合膜专为

晶圆层压工艺或作为预成型贴片而配制。这款粘合剂适用于中小尺寸的模具。

乐泰 ABLESTIK ATB 125GR2 带有集成式切割胶带，专为实现稳定的模具拾取而设计。