PRODUCT DESCRIPTION

LOCTITE® ABLESTIK ABP 8200TNP provides the following product

characteristics:

Technology Proprietary hybrid chemistry

Appearance Silver

Filler type Silver

Product benefits

Excellent adhesion to various

LDFs

Excellent RBO control

Oven curable

Snap curable

Robust reliability

Formulated without PFAS

ingredients

Cure Heat cure

Application Conductive die attach paste

Typical package application SOP, SOT, DFN, QFN, QFP

Key substrates Cu, rough Cu, Ag and PPF

LOCTITE® ABLESTIK ABP 8200TNP silver filled conductive

adhesive is a die attach paste designed for high reliability package

with good thermal and electrical conductivity. This material offers

excellent adhesion with small to large die size on a wide variety of

metal surfaces, including Cu, rough Cu, Ag and PPF lead-frames.

产品描述

乐泰 ABLESTIK ABP 8200TNP 具有以下产品特性：

技术：专有混合化学配方

外观：银色

填料类型：银

产品优势：

对各种引线框架 (LDF) 具有优异的粘合性

优异的 RBO 控制

可烘箱固化

可快速固化

可靠性高

不含 PFAS

固化方式：热固化

应用：导电芯片粘接膏

典型封装应用：SOP、SOT、DFN、QFN、QFP

主要基材：铜、粗糙铜、银和 PPF

乐泰 ABLESTIK ABP 8200TNP 银填充导电

胶粘剂是一种专为高可靠性封装设计的芯片粘接膏，

具有良好的导热性和导电性。该材料对各种尺寸的芯片均具有优异的粘合性，

适用于各种金属表面，包括铜、粗糙铜、银和 PPF 引线框架。