PRODUCT DESCRIPTION

LOCTITE® ABLESTIK 84-1LMISP4 provides the following product

characteristics:

Technology Epoxy

Appearance Silver

Filler type Silver

Cure Heat cure

Product benefits

Good workability

Good RBO control on multiple

metal surfaces

Excellent electrical and thermal

conductivity

Good adhesion to Cu, Ag and

rough Cu

Good adhesion to non-BSM and

BSM die

Application Conductive die attach paste

Application SOP, SOT, DFN, QFN, QFP

Key substrates Cu, rough Cu and Ag

LOCTITE® ABLESTIK 84-1LMISP4 electrically conductive die attach

adhesive is designed for high reliability packages applications. It

provides excellent electrical conductivity to achieve good RDS(on)

performance for MOSFET devices. This material offers great

adhesion on a wide variety of metal surfaces, including Cu, Ag and

kinds of rough Cu lead-frames, and covers wide die size range from

small to medium.

产品描述

乐泰 ABLESTIK 84-1LMISP4 具有以下产品特性：

技术：环氧树脂

外观：银色

填料类型：银

固化方式：热固化

产品优势：

良好的可操作性

在多种金属表面上具有良好的 RBO 控制优异的导电性和导热性对铜、银和粗糙铜具有良好的粘合性

对非 BSM 和 BSM 芯片具有良好的粘合性

应用：导电芯片粘接膏

应用封装：SOP、SOT、DFN、QFN、QFP

主要基材：铜、粗糙铜和银

乐泰 ABLESTIK 84-1LMISP4 导电芯片粘接剂专为高可靠性封装应用而设计。它

提供优异的导电性，以实现 MOSFET 器件良好的导通电阻 (RDS(on))

性能。该材料对包括铜、银和各种粗糙铜引线框架在内的多种金属表面具有良好的粘合性，

并适用于从小到中等尺寸的广泛芯片尺寸范围。