PRODUCT DESCRIPTION

LOCTITE ABLESTIK ABP 2053SNP provides the following product

characteristics:

Technology Proprietary hybrid chemistry

Appearance Red paste

Product benefits

Non-conductive

One component

Low stress

Formulated without intentionally

added PFAS

Cure Heat cure

Substrates Flex, laminate and die to die

Application Non-conductive die attach

LOCTITE ABLESTIK ABP 2053SNP is a non-conductive die attach

adhesive that has been used in array packaging. LOCTITE®

ABLESTIK ABP 2053SNP is a version of LOCTITE® ABLESTIK

ABP 2053S formulated without intentionally added PFAS.

产品描述

乐泰 ABLESTIK ABP 2053SNP 具有以下产品特性：

技术：专有混合化学配方

外观：红色膏状物

产品优势：

不导电

单组分

低应力

配方中未添加 PFAS

固化方式：热固化

适用基材：柔性材料、层压材料和芯片间连接

应用：非导电芯片粘接

乐泰 ABLESTIK ABP 2053SNP 是一种非导电芯片粘接胶，已应用于阵列封装。

乐泰 ABLESTIK ABP 2053SNP 是乐泰 ABLESTIKABP 2053S 的改进版本，配方中未添加 PFAS。