PRODUCT DESCRIPTION

LOCTITE ABLESTIK 2902 provides the following product

characteristics:

Technology Epoxy

Appearance Silver

Filler Type Silver

Cure Room Temperature or Heat Cure

Components Two components - requires mixing

Product Benefits 

● Electrically conductive

● Thermally conductive

● Solvent-free

● High adhesion

● Two component

● Room temperature cure

● Good adhesion to a variety of

substrates

Mix Ratio, by weight -

Resin : Hardener

100 : 6

Typical Assembly

Applications

Electrical modules, Printed circuitry,

Wave guides, Flat cables, High

frequency shields and Cold solder

Operating Temperature -60 to 110 °C

Application Bonding, Sealing or Repair

Surfaces Ceramics, Many metals, Glass and

Plastic laminates

LOCTITE ABLESTIK 2902 is designed for electronic bonding and

sealing applications that require a combination of good mechanical

and electrical properties.

LOCTITE ABLESTIK 2902 passes NASA outgassing standards.

ISO-10993-5

LOCTITE ABLESTIK 2902 was tested to and passed the

requirements of ISO 10993-5 for Cytotoxicity

产品描述

乐泰 ABLESTIK 2902 具有以下产品特性：

技术：环氧树脂

外观：银色

填料类型：银

固化方式：室温或加热固化

组分：双组分 - 需要混合

产品优势：

● 导电

● 导热

● 无溶剂

● 高粘合力

● 双组分

● 室温固化

● 对多种基材具有良好的粘合力

混合比例（重量比）：

树脂：固化剂

100 : 6

典型应用

电气模块、印刷电路、波导、扁平电缆、高频屏蔽层和冷焊

工作温度：-60 至 110 °C

应用：粘接、密封或修复

适用表面：陶瓷、多种金属、玻璃和塑料层压板

乐泰 ABLESTIK 2902 专为需要兼具良好机械性能和电气性能的电子粘接和

密封应用而设计。乐泰 ABLESTIK 2902 符合 NASA 的气体释放标准。

ISO-10993-5

乐泰 ABLESTIK 2902 已通过 ISO 10993-5 细胞毒性测试，符合该标准。